PECVD

Description: Advanced Vacuum Vision 310 Plasma Enhanced Chemical Vapor Deposition System
Location: Chapman Hall - Cleanroom
Uses:

The PECVD system can deposit low stress silicon nitride and silicon dioxide films.

Specifications:

The PECVD is equipped with a patented dual frequency generator, 500W at 187 kHz and 300W at 13.56 MHz, that allows for the deposition of low stress films. The sample plate can accommodate samples up to 250 mm in diameter, and has temperature control from 30ºC to 300ºC. The system is equipped with seven digital mass flow controllers with bypass and flush capabilities and up and downstream isolation valves.

Download Operating Procedure